Dear Eole, I don't know how much you're willing to spend, but I know of a company in Pittsburgh called Solid State Measurements. A few years ago they developed a contact probe method to determine C-V and I-V curves for the semiconductor industry. I'm not sure what your EM constraints are, but I suppose you could ramp the voltage to under some critical voltage and see if you get leakage currents or a drop in capacitance. If this isn't viable, then ultrasonics is the way to go. The airline industry uses ultrasonics to determine crack sizes, as do most structural engineering NDT methods. As far as insterting into your production line, there's really no "fast" way to do it, and I doubt it would be cheap. From what I understand, the method involves random sample statistics from every "heat". Hope that clears up mud for you, although it probably only mucked up the clear.
-SrvClapton