ISQED04, CALL FOR PAPERS

Aug 01, 2003 0 Replies

C A L L F O R P A P E R S


ISQED 2004


5th International Symposium on


QUALITY ELECTRONIC DESIGN


March 22-24, 2004



San Jose, CA, USA


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The International Symposium on Quality Electronic Design (ISQED), is a premier Design & Design Automation conference, aimed at bridging the gap between and integration of, electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality.



ISQED is the pioneer and leading conference dealing with design for manufacturability issues. The conference provides a forum to present and exchange ideas and to promote the research, development, and application of design techniques & methods, design processes, and EDA design methodologies and tools that address issues which impact the quality of the realization of designs into physical integrated circuits. The conference attendees are primarily designers of the VLSI circuits & systems (IP & SoC), those involved in the research, development, and application of EDA/CAD Tools & design flows, process/device technologists, and semiconductor manufacturing specialists including equipment vendors. ISQED emphasizes a holistic approach toward design quality and intends to highlight and accelerate cooperation among the IC Design, EDA, Semiconductor Process Technology and Manufacturing communities.


Papers are requested in the following areas:


Design for Manufacturability



Methodologies and Metrics for Design Quality



Design for Testability



Package - IC Design Interactions & Co-Design



Device, Interconnect and Circuit Level Modeling and Analysis



EDA Tools, Interoperability and Implications



Low Power Design and Test



Physical Design, Methodologies & Tools



Design and Abstraction Methods for SoCs, IP Blocks and Libraries



Effects of Technology on IC Design, Performance, Reliability, and Yield


Paper Submission Deadline September 15, 2003



Acceptance Notifications November 1, 2003



Final Camera-Ready paper December 15, 2003


Please refer to the web site at

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for detail information about the paper submission process.


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