16 years ago
I've got a TiO2(110) wafer for my STM experiment but it seems to exceed
the allowed sample size. Now I need to cut it, but as far as I know, the
cleavage is easy only in one direction, i.e. parallel to (110) plane.
The wafer is 0.5 mm thick. Does anybody know how to cut it without
destroying completely the wafer? Any help is greatly appreciated.
Regards, Antoni Rok