How to remove solutions included in gold colloid exception for gold particles

Hi, I'm a Ph.D student in Korea. I have fabricated wire of photoresist(ormocomp) and I want to make it condu ctive by coating gold particles from gold colloid(Sigma, G1527-25ML) whose
detail is following.
"All unconjugated gold colloids contain approximately 0.01% HAuCl4 suspende d in 0.01% tannic acid with 0.04% trisodium citrate, 0.26 mM potassium carb onate, and 0.02% sodium azide as a preservative."
After fabrication, I poured the gold particle solution on the fabricated wi re and dried the solution in open air at room temperature. I repeated pouri ng and drying process more than 30 times. However I failed to get conductiv ity from wire covered by gold particles. In my think, this non-conductivity is due to the presence of substances oth er than Au(gold particles). I want to know how to remove substances in gold colloid.
If you have information of this research, please give me your opinion.
Thank you.
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Jungdae Kim wrote:

conductive by coating gold particles from gold colloid(Sigma, G1527-25ML) whose detail is following.
I've never heard of doing it this way. Does it matter how the wire is made conductive, or does it have to be gold?
There are commercial chemistries for depositing conductive carbon and palladium. These are used for making plated-through holes in circuit boards. Copper is electrodeposited on top of the electroless seed layer. Union Carbide makes a carbon process, and Shipley makes a palladium process.
There are also chemistries for electroless silver used for making mirrors. See the book _Mirrors_ by Bruno Schweig for a comprehensive discussion of electroless deposition of various metals on glass for making mirrors.
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