For my application, I want to electroplate a metal onto a non-conductor at a thickness of less than 100 nanometers - a few tens of nanometers thickness would be ideal. My purpose is to create very thin conducting wires so copper, aluminum, nickel would all be acceptable. Since I want these to act as wires they should be approximately the same width as depth and centimeters long. They are allowed to be rectangular rather than cylindrical in cross-section. Ideally, I would like to be able peel these off the substrate but I may be able to use them on the substrate as long as the substrate is non-conducting. Actually, I've read that it is much easier to deposit onto a conducting substrate but if done this way it would be important to be able to peel the wires off the substrate since for my application it is essential that the conducting material be less than 100 nanometers in diameter. One more requirement: it has to be doable at the amateur and low cost level, that is without the facilities of an industrial or university site.
Is this achievable?
Bob Clark